JPH0420279B2 - - Google Patents
Info
- Publication number
- JPH0420279B2 JPH0420279B2 JP10991084A JP10991084A JPH0420279B2 JP H0420279 B2 JPH0420279 B2 JP H0420279B2 JP 10991084 A JP10991084 A JP 10991084A JP 10991084 A JP10991084 A JP 10991084A JP H0420279 B2 JPH0420279 B2 JP H0420279B2
- Authority
- JP
- Japan
- Prior art keywords
- recess
- metal plate
- board
- mounting
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 51
- 239000002184 metal Substances 0.000 claims description 51
- 239000000758 substrate Substances 0.000 claims description 30
- 238000007747 plating Methods 0.000 claims description 21
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 19
- 230000017525 heat dissipation Effects 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10991084A JPS60253291A (ja) | 1984-05-29 | 1984-05-29 | 電子部品搭載用基板およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10991084A JPS60253291A (ja) | 1984-05-29 | 1984-05-29 | 電子部品搭載用基板およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60253291A JPS60253291A (ja) | 1985-12-13 |
| JPH0420279B2 true JPH0420279B2 (en]) | 1992-04-02 |
Family
ID=14522244
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10991084A Granted JPS60253291A (ja) | 1984-05-29 | 1984-05-29 | 電子部品搭載用基板およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60253291A (en]) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685464B2 (ja) * | 1984-09-06 | 1994-10-26 | イビデン株式会社 | 電子部品搭載用基板の製造方法 |
| JPH0740598B2 (ja) * | 1986-04-30 | 1995-05-01 | イビデン株式会社 | 半導体搭載用基板およびその製造方法 |
| JPH0746707B2 (ja) * | 1986-06-30 | 1995-05-17 | イビデン株式会社 | 半導体搭載用基板およびその製造方法 |
| JP2520429B2 (ja) * | 1987-10-27 | 1996-07-31 | 松下電工株式会社 | 電子部品実装用プリント配線板 |
| JPH0379440U (en]) * | 1989-12-01 | 1991-08-13 | ||
| JP4856470B2 (ja) * | 2006-05-18 | 2012-01-18 | 日本特殊陶業株式会社 | 配線基板 |
| WO2014017273A1 (ja) * | 2012-07-27 | 2014-01-30 | 京セラ株式会社 | 半導体素子収納用パッケージおよび半導体装置 |
| WO2016121340A1 (ja) * | 2015-01-29 | 2016-08-04 | 日本電気株式会社 | 高周波モジュールおよび高周波モジュールの製造方法 |
-
1984
- 1984-05-29 JP JP10991084A patent/JPS60253291A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60253291A (ja) | 1985-12-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |